See Appendix "A" for the seating press recommendations and process recommendations. Amphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. FEATURES. $19. Brand of Product：Amphenol ICC,Part#：946-200X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. 80 mm High-Density Backplane Right-Angle Receptacle. XCede Product Family Connector Press-fit Installation Process . 062") thick cards. 2. 80mm Right-Angle Backplane Receptacle; HDTF-6-08-S-RA-LC-100; HDTF - Samtec XCede® HD 1. ExaMAX ® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis. 2. Features. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. XCede® Connectors - Amphenol CS | DigiKeyFounded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. Buy 10113949-L0E-20DLF - Amphenol Communications Solutions - Connector, FCI XCede Series, 32 Contacts, Header, Press Fit, 8 Rows. EN. Search for: Search Home; Categories. 0177" drill, nano ni, std gold 1. TB-2253 XCede HD Family Daughtercard Wafer Removal and Replacement. 1. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission. 4、6或8列. Choice of 2 or 4 power banks. Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing Housing: High-temperature thermoplastic, UL94-V0 Wafers: High-temperature thermoplastic, UL94-V0 Contacts: High-performance copper alloy Platings. 4, Gen. 4 differential pairs/inch. Search. XCede® connector family. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 2. Download M12 PCB MOUNT CONNECTOR, X-CODED, FEMALE. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. Figure A-9 shows this requirement pictorially. Contact Mouser (USA) (800) 346-6873 | Feedback. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. Resource The top level of the. XCede® connectors also address. For XCede HD RAM and XCede HD Inverted RAM refer to this documents. 60mm Gen-Z connectors conform to SFF-TA-1002, OCP NIC 3. BAcKpAneL connectors Fci’s Xcede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. High-density backplane system – up to 84 differential pairs per linear inch. Skip to Main Content +49 (0)89 520 462 110. We believe that unlocking the potential of our workforce through outstanding training, earnings potential and reward structures is key to Xcede’s success. Skip to Main Content (800) 346-6873. 00 mm contact wipe on signal pins. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. These connectors are two-piece devices that connect two printed circuit boards. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane interconnect systems. 11. Skip to content. Buy XCede HD Plus Series Backplane Connectors. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick WallXCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. Let’s take a look at a typical higher level motherboard for an example of connector and port types. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. $ 129. 2. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. No spam. XCede® HD 1. We would like to show you a description here but the site won’t allow us. 3-, 4- and 6-pair designs. 2. Part # dimensions for each XCede connector type. 00mm pitch (FF5026) and 050mm pitch (FF3025). Mouser offers inventory, pricing, & datasheets for Samtec XCede High Speed / Modular Connectors. xcede hd backplane assembly 4 pair connector, leadfree part no. XCede® connectors also address. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. 1. XCede HD2 backplane interconnect system. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. /PRNewswire/ -- Newark/element14, a leading multi-channel, high-service electronics distributor in the Americas, and a business of global Premier Farnell,. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede® connectors also address. 54mm pitch down to 0. Wang 6/19/19. 1. Backwards mating compatible with XCede ® HD connector. XCede HD PLUS & XCede HD2 daughtercard single wafer replacement. XCede® HD 1. 7. Pitch (mm): Circuits: Current (MAX per contact): Voltage: 1. 60mm (. Contact Mouser (Bangalore) 080 42650011 | Feedback. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office. Login or REGISTER Hello, {0}. XCede HD, Backplane Connectors, Right Angle Header LC, 4-pair, 8-column, 85ohms. 2. 2. 3. For optimal connector configuration, connectors are grouped into signal modules of 4,. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 2. Login or REGISTER Hello, {0}. Distance Graph showing two shapes of the knee area utilizing an 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. EN. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. Buy 928-4050-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Plus Series, Receptacle, Press Fit. Available in industry-standard 2. See section 4 regarding XHD2 RAM connectors. 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Login or REGISTER Hello, {0}. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Offering a linear density of up to 84 differential pairs per inch (33. 1. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane interconnect systems. Revision SCR No. 28G ADDITION TO THE XCEDE ® HD FAMILY XCede ® HD plus leverages the same. XCede® connectors also address. Samtec XCede® HD HPTS 3. refer to c-922-4x0a-500 for signal connector detail. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® HD 1. Skip to Main Content (800) 346-6873. XCede® HIGHdPERFORMANCE BACKPLANE CONNECTOR. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall 高速背板系统. Dislaime Please note that the above information is subject to change without notice. These modules consist of a 12. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. 0 REFERENCE 2. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. Customer Measurement Report: FCI XCede® Connector. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Back. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 2. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. 1. We would like to show you a description here but the site won’t allow us. Login or REGISTER Hello, {0}. Discover More. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede HD achieves the highest performance in an HM compatible form factor. TARGET MARKETS. They're small enough for most consumer RF applications and they use a threaded housing to create strong mechanical connections. Out of these, the cookies that are categorized as necessary are stored on your browserGermany. Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Sign Up or Register. 00mm: 2 - 54: 1. 99 $ 19. XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® connectors also address. The XCede ® HD Plus backplane connector achieves high . Specs Kit. EBCF. Login or REGISTER Hello, {0}. The XCede ® HD Plus backplane connector achieves high . 4 FMC+ VITA 74 VNX适用于密度关键型应用的小型高密度背板系统，采用模块化设计并提供可选功能，以提升灵活性和实现可定制解决方案。XCede® BACKPLANE CONNECTOR SYSTEM - FCI. DETAILS. 3. XCEDE CONNECTOR ECCN / UNSPSC / COO. Login or REGISTER Hello, {0}. XCede® Family Cable Assemblies § Extends the reach of passive copper for next generation real world system designs; complementary with direct orthogonal designs, intermatable with existing board mount connector designs § Lowers overall system costs by reducing or eliminating the need for expensive active devices like retimers and high XCede HD2 backplane interconnect system. 3. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal. XCede® Family Cable Assemblies MATERIAL §§Contacts: High. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. 2. the use of advanced engineering polymers in a unique 3-D resonance. 3、4和6对设计. During this. - FCI. Buy XCede HD Series Backplane Connectors. 3. Shear Stud Connectors. XCede® HD是一个采用. 96 and 5. Subscribe news. 1. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. Login or REGISTER Hello, {0}. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. XCede Plus Backplane Connector. Formed in 2020 by a merger of three well-established organisations — TechStream, Xcede and Etonwood — our mission is to attract the talent that is helping our clients shape the new global economyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Login or REGISTER Hello, {0}. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Vertical or Right Angle. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. 1 Fillets An extension of the pad at the interface of the trace to the pad that will allow more pad area in the event that the pad to hole registration compromises the interconnect area. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. High-density backplane system – up to 84 differential pairs per linear inch. 2. XCede® HD is a small form factor system with a modular design for significant space savings and. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. Vertical or Right Angle. Login or REGISTER Hello, {0}. 4. XCede® connectors also address. XCede ® HD Plus. 1. This connector ships without wires, terminals and seals. XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). 1. 80 mm高密度背板垂直插头. The Molex EXTreme LPHPower Connector is a mixed, high current power and signal connector system that picks up where traditional connectors leave off. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. c-jx410-51594 a creo files jx410-51594_bp . Up to 82 differential pairs per linear inch. B S4329 Added XCede HD PLUS backplane information B. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. See section 4 regarding XHD2 RAM connectors. 信号端子上可实现高达3. 1. Amphenol Xcede Series High Speed/Modular Connectors are available at Mouser Electronics. Inactivity Warning Dialog. 00 mm contact wipe on signal pins. 0” Long. Check Pricing. Manufacturer of Connector and Connector Systems. Features. Search. Meets the high density needs of today's designs. Login or REGISTER Hello, {0}. Please confirm your currency selection:2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal,. Contact Mouser (USA) (800) 346-6873 | Feedback. English. 0225" Drill Compliant Pin Protrusion (mm) (negative numbers result in no protrusion) 0. 三个等级的上电次序实现了热插拔. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 99. Click to download Certificate of. 1. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. Login or REGISTER Hello, {0}. 1. EachAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Change Location. The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. You previously purchased this product. 1 XCede HD , XCede HD PLUS & XCede HD2 Daughtercard Customer Use Drawings 2. element14 Malaysia offers special pricing, same day dispatch, fast delivery, wide inventory, datasheets & technical support. XCede ® High-Performance Backplane Connector System. 1 DOCUMENTS 2. Close Modal. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . KK connector systems are customizable for a variety of power and signal applications. 2 The daughtercard connector building blocks include signal modules, power modules,. 6 %âãÏÓ 2647 0 obj > endobj 2677 0 obj >/Encrypt 2648 0 R/Filter/FlateDecode/ID[65646E18716E2B4991C9C621A98364C7>]/Index[2647 447]/Info 2646 0 R/Length 155. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). 062") thick cards. Kuject 320 PCS Heat Shrink Wire Connectors, Multipurpose Waterproof Electrical Wire Terminals kit, Insulated Crimp Connectors Ring Fork Spade Butt Splices for Automotive Marine Boat Truck. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. Brand of Product：Amphenol ICC,Part#：946-230X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. Basics is present with its full range of products to meet the needs of our customers. XCede® connectors also address. 1. 4. Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. QSFP+ 40G transceiver with MTP/MPO connector; MTP/MPO 12 Fiber Trunk Cable. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThis document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. Connectors; High Speed Board-to-Board; Micro Pitch Board-to-Board; Rugged / Power; Edge Card; Backplane / Micro Backplane; Standard Board-to-Board; Industry Standards;. {{metaDescription}} FCI’s XCede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in. Login or REGISTER Hello, {0}. Accessories; Audio Products; Capacitors; Circuit Protection; Circuit Breaker Protection Devices ExplainedDislaime Please note that the above information is subject to change without notice. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 7mil Drill Minimum Pad Size vs. 1. 2. Mouser offers inventory, pricing, & datasheets for XCede Connectors. Nashua, NH, February 2, 2009– Amphenol TCS, the leading provider of high performance backplane interconnect systems, today announced two additions to the XCede® connector platform – XCede 85 Ohm and XCede cables and assemblies. Features. XCede® connectors also address. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. XCede® connectors also address. Available in industry-standard 2. Find Parts Learn More. See section 4 regarding XHD+ RAM connectors. DETAILS. Login or REGISTER Hello, {0}. - FCI. Samtec XCede® HD HPTS 3. 4. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThe XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. F X Connectors in Victoria, reviews by real people. XCede ® HD2. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Daugtercard connectors feature Amphenol’s integral stiffener which allows designersDataspace Connector's data model is designed based on IDS-RAM. by Xcede. 5 out of 5 stars 3,424. DC configurations may also be determined by the XHD+ RAM connector to which they will mate for co-planar applications. FCI released XCede vertical backplane headers and right-angle daughter card receptacles designed for 25 Gb/s performance. 3. English. This document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). . 3A per pin current rating and mount individually to the backplane. 0 - 30. 54mm pitch down to 0. We chose the Asus Prime X470-Pro for its inclusion of many modern. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Login or REGISTER Hello, {0}. Integrated power and guidance. Get a Free Sample. Video Library > XCede® HD - Samtec’s High-Density Backplane System XCede® HD - Samtec’s High-Density Backplane System XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. 3. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Three levels of sequencing enable hot plugging. 2. PCIe ® (peripheral component interconnect express) is an interface standard for connecting high-speed components in a computer or server. 8 mm column pitch representing a 35% increase versus XCede®. ExaMAX® 2. Type S (same-side) and Type O (opposite-side) contact layouts allow for mirrored contacts. performance (up to 28+ Gb/s) in a Hard Metric form factor. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. challenging architectures. We offer interconnection systems from 2. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. These modules consist of a 12. 1 DOCUMENTS 2. Integrated power, guidance, keying and side walls available. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 1. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . Pin header. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. FCI 159 KAMPONG AMPAT, KA, PLACE,. XCede® connectors also address. 63. 3. EspañolAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission and. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactAmphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 08mm. 1 DOCUMENTS 2. 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU.